Cadence launches Allegro X AI, aimed at accelerating the PCB design process and reducing turnaround time by more than 10 times

Allegro X AI can automatically perform PCB layout design and small to medium-sized PCB wiring design, reducing physical layout wiring and analysis time from days to minutes

Cadence Electronics (NASDAQ: CDNS) today announced the launch of Cadence ® Allegro ® X AI technology, a new generation of Cadence system design technology, has achieved revolutionary improvements in performance and automation. This new AI product relies on the Allegro X Design Platform platform, which can significantly save PCB design time. Compared to manually designing circuit boards, it reduces the time required for layout and routing (P&R) tasks from days to minutes without sacrificing or even potentially improving quality.

Traditionally, layout and wiring in PCB design has been a time-consuming manual process that can affect the speed of product launch. Allegro X AI technology utilizes the scalability of the cloud to achieve physical design automation. While providing PCB generative design, it also ensures electrical accuracy and can be used for manufacturing. This new technology can automatically perform device placement, metal plating, and critical network wiring, and integrates fast signal integrity and power integrity analysis functions. By using generative AI functionality, customers can simplify their system design process and shorten PCB design turnaround time by more than 10 times.

Allegro X AI technology has the following advantages:

Improve productivity: Adopting a scalable architecture and utilizing cloud computing infrastructure to achieve automatic layout and routing, significantly reducing design turnaround time.

Better result quality: Utilizing the generative AI automatic layout function, feasibility analysis can be conducted in the early stages of design. Beyond manual methods, explore more possibilities for solutions, and further optimize various indicators, such as reducing line length while adhering to design constraints.

• Efficient Design closure: Allegro X platform is closely integrated with system analysis technology, enabling users to optimize the electrical and thermal performance of the design.

Cadence is committed to providing system design solutions that integrate artificial intelligence and cloud technology, ensuring the fastest turnaround time, "said Michael Jackson, Vice President of Research and Development at Cadence, The newly launched Allegro X AI technology consolidates Cadence's technological leadership in PCB design and has a transformative impact. Through artificial intelligence driven automation, enhanced engine performance, and integration with Cadence's system design and analysis product portfolio, it helps customers improve productivity

The newly launched Allegro X AI technology supports Cadence's Intelligent System Design ™） Strategy aimed at helping customers accelerate system innovation. For more information, please visit www.cadence.com/go/AllegroXAI.

Customer feedback:

Allegro X AI technology has reduced the layout time from a few days to a few minutes, while also considering the impact of signal integrity and power integrity. The equipped AI technology can also provide new layout solutions. This technology greatly shortens the design time and will fundamentally change the way we design PCBs

                                                ---Allan N ø rgaard, CID, Velux PCB Design Department

At Schneider Electric, turnaround time and the quality of the final product are crucial for business success. With Cadence's Allegro X AI technology, we can significantly shorten development cycles. Hardware designers can evaluate density and complexity, and adjust electrical designs to ensure fast and efficient design completion, while increasing productivity

---Jean Christophe Dejean, Vice President of Process and Management, Schneider PLM

The work efficiency of designers is crucial for Kioxia's business success. Our team is working closely with Cadence to utilize Allegro X AI technology to achieve automatic layout and routing of IC packaging and PCB reference designs, significantly reducing design turnaround time

---Chiaki Takubo, Technical Director, Packaging and Testing Technology Department, Kioxia Corporation