Main Trends of PCB Development in 2022

With the tremendous impact of the latest technologies, such as 5G, the Internet of Things and artificial intelligence, on the electronic world, PCB manufacturing has developed a lot. New trends in PCB development are rapidly catching up. It is estimated that the global PCB market size in 2023 will be about US $70-75 billion.

Various fields related to PCB are developing at the same time, including: direct imaging, in which circuit patterns are directly printed on materials; New substrate materials; New method of surface finish test; Flexible PCB; Automation degree of manufacturing process; And more environmentally friendly.

The root of these technology trends is the growth of market demand for PCB.

The communication speed is developing rapidly with the 5G technology network. IoT technology has created specific IoT devices for almost every industry, including industrial automation, smart home, medical care and wearable devices. Artificial intelligence and machine learning have infiltrated into the field outside the manufacturing or assembly workshop.

Wearable devices such as eyeglasses, chip implants, or artificial limbs. Automatic driving technology is used to realize different levels of function or action automation, including driverless vehicles and unmanned aerial vehicles.

PCB development trend listed in the global circuit board market

There are different requirements for different technical fields of PCB, such as changing the shape of PCB or related accessories. Recently, camera modules have made significant progress to improve high-resolution image and video imaging. Car cameras will become a strong demand beyond consumer electronics and industrial fields.

3D Printing Electronics (3D PE) is changing the design of electrical systems. 3D PE is an additive manufacturing process, which can build 3D circuits by printing substrates layer by layer. 3D printing can quickly make prototypes in a short time. No minimum build is required. With this printing technology, no plate making process is required. Because of automation, this will expand product functionality and improve overall efficiency.

Compared with traditional PCBs, high-density interconnect (HDI) PCBs provide high performance and extremely thin materials. This provides compact wiring, tiny laser vias, and pads. HDI PCB is the first choice of miniaturized electronic products.

With the increase of mobile phone and Internet TV subscriptions, consumer electronics products are one of the fastest growing trends. Wearable devices such as smart watches have also contributed to the expansion of the consumption field. These applications are increasing the demand for compact, precise and multifunctional PCBs. In addition, due to their durability and size advantages, the latest Internet of Things applications are promoting the development of flexible and rigid flexible PCB.

The extensive use of chips in the semiconductor industry has forced PCB experts to research new alternatives. The non degradable electronic waste has also seriously affected the environment, leading designers to explore organic or biodegradable PCB as a substitute.

The solutions supporting AI are now at the forefront of almost all industrial fields. The application of artificial intelligence is creating a demand for PCB design and manufacturing process improvement. Focusing on accelerating the development cycle to reduce defects and quickly deliver products is the key goal of the growing PCB industry.

Traditionally, PCB is a passive medium used to connect active components of circuit design. Recently, however, designers have been exploring the possibility of making PCB itself an active component of a circuit. This approach can reduce the requirements of components while performing the required functions.

Technology trends such as augmented reality (AR) and virtual reality (VR) are dominating the field of consumer electronics and influencing PCB design to solve problems such as installing electronic packages in unconventional shapes. This will confirm correct circuit operation and reduce layout and wiring technical requirements. In addition, AR with software simulation method can reduce the cost of training program, because advanced simulation can replicate the actual environment of magnetic field and electric field. This will confirm that the product complies with the required regulations.

The demand for electric vehicles and autonomous vehicle is growing rapidly, and the requirement for PCB with good heat dissipation capability is also increasing. Advanced automotive PCB design will solve safety, convenience and environmental problems. New energy sources such as power electronics will require PCB with excellent thermal design. High current requirements and heating problems should be addressed during PCB design. It is mandatory to select an enhanced PCB harness and follow an effective layout strategy.

The complex design requirements for multilayer PCB manufacturing cover all applications. PCB in medical and aerospace applications need to strictly control EMI problems. In addition, mobile phone developers need to minimize unnecessary radiation hazards. If PCB design does not comply with EMI regulations, large quantities of circuit boards may eventually be redesigned, increasing costs and delaying final delivery. The growing popularity of flexible PCB also brings new challenges to PCB designers. There is a high possibility of electromagnetic interference between components and routing in flexible PCB, which leads to performance degradation. This problem leads to the need for a built-in ESD protection system.

With the development of the trend, the speed of PCB design and development has been greatly improved. But by spending more time designing, manufacturing, and assembling products, errors and debugging costs can be reduced.

As PCB development trends change with the latest technological innovation, PCB manufacturers will have to establish more dynamic supply chains and flexible manufacturing processes to meet the requirements of these PCB trends.