Winbond launched the next generation 8Mb Serial NOR Flash, which is applicable to IoT Edge device with limited space

Winbond, a leading manufacturer of global semiconductor storage solutions, today announced the launch of 8Mb 3V W25Q80RV, the first product of Serial NOR Flash. This product has stronger reading performance and smaller size, especially to meet the needs of Edge device in industrial and consumer application scenarios.

This 8Mb capacity Serial Flash is produced by Winbond 'own 12 inch wafer factory, and is manufactured with the latest generation of 58nm technology. Compared with the previous generation of 90nm products, the size of the serial Flash is significantly reduced. The KGD and WLCSP versions of this product are very suitable for various small IoT devices.

Alan Niebel, president of Web Feed Research, an independent market research company, said: "By 2023, the Internet of Things will expand to 50 billion connecting devices. Huabang's 3V 8Mb Serial NOR Flash is very suitable for the field of cars and the Internet of Things. In general, the Internet of Things is expected to continue to grow in the new connected world. By 2027, the global shipment of Serial Flash will reach 12.9 billion."

Winbond has used W25QxxDV series products to support customers' demand for 8Mb Serial Flash in the past years, and its application fields include instruments, networking devices, PCs, printers, automotive and game devices. Nowadays, the launch of W25QxxRV can support more emerging applications and use cases. For example, in advanced technology, wireless connectivity is achieved using KGD and WLCSP solutions, and smaller framework packaging is used.

Winbond has supplied KGD solutions for more than ten years. KGD products have been quite mature and have undergone rigorous testing. They have the same reliability level as packaged products, and are very suitable for stacking with MCU and SoC that need high-speed flash memory. The 8Mb flash memory product launched by Winbond this time has higher reading speed, which can improve system performance, and also brings faster programming and erasing speed for firmware OTA and industrial applications. In addition, the smaller overall size and in system packaging (SiP) of this product bring greater value to various embedded systems.

The W25Q80RV supports all mainstream single/dual/four channel QPI commands and read modes. The W25Q80RV also supports direct code execution from dual/quad channel SPI (XIP) and code mapping to RAM. This product uses a single power supply of 2.7V -3.6V, with a shutdown current as low as 1 μ A. In addition, flash memory is also organized into small sectors of 4KB, providing greater flexibility and storage efficiency in applications that require code, data, and parameter storage. It can also support SPI clock frequencies up to 133MHz single channel transmission and 66MHz dual channel transmission. The Read Command Bypass Mode also allows for faster memory reads, enabling true on-chip execution (XIP) operations.

Jackson Huang, Vice President of Flash Product Market of Winbond, said, "We are proud that Huabang is committed to achieving innovation and differentiation by designing our Serial Flash KGD and WLCSP solutions. Serial Flash KGD and WLCSP are suitable for special applications that require small size and non-volatile storage of MCU and SoC. Huabang will continue to work closely with customers in the future to bring more value to the next generation of embedded solutions."

The W25Q80RV has now been launched, and multiple capacity versions of the product series will be launched in the future. For more information, please visit www.winbond.com.

About Huabang

Winbond is a leading manufacturer of global semiconductor storage solutions. Its main businesses include product design, technology research and development, wafer manufacturing, marketing and after-sales service, and it is committed to providing customers with a full range of niche memory solutions. Winbond products include niche dynamic random access memory, mobile memory, coded flash memory and TrustME ® Secure flash memory is widely used in communication, consumer electronics, industrial and automotive electronics, computer peripherals, and other fields. Winbond is headquartered in Central Taiwan Science Park, Taiwan, China, China. It has two 12 inch wafer factories in Taichung and Kaohsiung. In the future, it will continue to introduce self-developed process technology to provide high-quality memory products for partners. In addition, Huabang has subsidiaries in Chinese Mainland, Hong Kong, the United States, Japan, Israel, Germany and other places to take charge of marketing business and provide local support services for customers.