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Toshiba introduces a 40V N-channel power MOSFET with a new type of high heat dissipation package

Release Time:2023-02-06
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Toshiba launched a new type of 40V N-channel power MOSFET with high heat dissipation package, supporting the demand of on-board equipment for higher current


Toshiba Electronic Components and Storage Devices Co., Ltd. ("Toshiba") has introduced the new L-TOGL ™ (large transistor profile gull-wing pin) packaged on-board 40V N-channel power MOSFET "XPQR3004PB" and "XPQ1R004PB". These two products have high rated drain current and low on-resistance. The product will be shipped today.

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The on-board 40V N channel power MOSFET with a new type of high heat dissipation package supports the demand of on-board equipment for higher current. (Picture: American Business Information)


In recent years, with the transition from vehicles to electric vehicles, the industry's demand for components that can meet the higher power consumption of on-board equipment is also increasing. These two new products adopt Toshiba's new L-TOGL ™ Package, supporting large current, with low on-resistance and high heat dissipation performance. The product does not use the internal terminal [1] structure, and integrates the source connector and external pin by introducing a copper clip. The source pin adopts a multi-pin structure. Compared with the existing TO-220SM (W) package, the package resistance decreases by about 30%, thus increasing the drain rated current (DC) of XPQR3004PB to 400A, 1.6 times of the current product [2]. The application of thick copper frame reduces the channel-to-shell thermal resistance in XPQR3004PB to 50% of the current product [2]. These characteristics are conducive to supporting greater current and reducing the loss of on-board equipment.


With the new packaging technology, the new product can simplify the heat dissipation design, reduce the number of MOSFETs required for applications requiring large current such as semiconductor relays and integrated starter generator frequency converters, and thus help to reduce the size of the equipment. When multiple devices need to be connected in parallel to provide greater working current for applications, Toshiba supports the two new products to be shipped in groups [3], that is, products are grouped according to the grid threshold voltage. This can ensure that the design scheme uses the same group of products, thus reducing the characteristic deviation.


Because on-board equipment may work in various temperature environments, the reliability of surface-mounted solder joints is a key factor to be considered. The new product uses gull-wing pins to reduce the mounting stress and improve the reliability of solder joints.


Application


• On-board equipment: frequency converter, semiconductor relay, load switch, motor driver, etc.


Characteristic


• New package L-TOGLTM

• High rated drain current:

XPQR3004PB:ID=400A

XPQ1R004PB:ID=200A

• AEC-Q101 certification

• Low on-resistance:

XPQR3004PB: RDS (ON)=0.23m Ω (typical value) @ VGS=10V

XPQ1R004PB: RDS (ON)=0.8m Ω (typical value) @ VGS=10V


Main specifications

(Unless otherwise specified, @ Ta=25 ℃)


Device model

XPQR3004PB

XPQ1R004PB

Polarity

N channel

N channel

Absolute maximum rating

Drain-source voltage VDSS(V)

40

40

Drain current(DC)ID(A)

400

200

Drain current (pulse)IDP(A)

1200

600

Junction temperature Tch(℃)

175

175

Drain-source on-resistance


RDS (ON) maximum value(mΩ)

@VGS=6V

0.47

1.8

@VGS=10V

0.30

1.0

Channel to shell thermal resistance Zth (ch-c) maximum@Tc=25℃(℃/W)

0.2

0.65

encapsulation

L-TOGL™

L-TOGL™

series

U-MOSIX-H

U-MOSIX-H

Inventory inquiry and purchase

Online purchase

Online purchase


Note:

[1] Solder connection

[2] Current product: "TKR74F04PB" packaged with TO-220SM (W)

[3] Toshiba provides group shipment, and the gate threshold voltage fluctuation range of each roll of products is 0.4V. However, it is not allowed to specify a specific group. Please contact Toshiba sales representative for more information.


For more information about new products, please visit:


XPQR3004PB

XPQ1R004PB


For more information about the new product, please visit the following link.


On-board MOSFET new SMD package "L-TOGL ™” Introduction (video)

Packaging trend of on-board MOSFET


Application:


Automobile integrated starter generator

Automobile engine control

On-board DC-DC converter


Please click the link below to learn more about Toshiba on-board MOSFET.


On-board MOSFET


To check the inventory of new products at the online dealer, please visit: XPQR3004PB

Online purchase


XPQ1R004PB

Online purchase


* L-TOGL ™ Is a trademark of Toshiba Electronic Components and Storage Devices Co., Ltd.

*Other company names, product names and service names may be trademarks of their respective companies.

*The product prices and specifications, service contents and contact information in this press release are the latest information on the date of release. Any subsequent changes are subject to change without notice.




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