Melexis's new PCB free pressure sensor chip brings automotive engine management accuracy to a new level

Melexis, a global microelectronic engineering company, announced today that it has officially released two types of relative pressure sensor chips, which have better robustness in harsh media. These two ultra high precision pressure sensor chips launched for the market perfect the Melexis PCB free platform product line. With this series of pressure sensor chips, customers and vehicle manufacturers will be able to make all their internal combustion engine management applications more environmentally friendly through a single modular technology. To further simplify customer production procedures, this series of devices have been factory calibrated, and of course, customers can also recalibrate as needed.

Melexis, a global microelectronic engineering company, has launched two new PCB-free pressure sensor chip products. MLX90823 (analog output) and MLX90825 (digital SENT output) are two relative pressure sensor chips that support either gauge mode (corresponding to atmospheric pressure) or differential mode (with two variable pressure levels). Unlike absolute pressure sensor chips, they can measure the pressure difference on both sides of the sensor chip. These factory calibrated devices are designed to measure pressure ranges ranging from 0.1 to 1.5 bar.

These two new pressure sensor chips can take the measurement accuracy of the automotive industry to a new level. Obtaining stable and accurate pressure and temperature data helps achieve full lifecycle management of the engine and can help OEMs reduce emissions from the last generation of internal combustion engine vehicles. The plug and play capabilities supported by Melexis' pressure sensor chip family support a wide range of internal combustion engine management applications. These include:

● Fuel vapor and crankcase ventilation applications: Ensure that fuel vapor in the fuel tank or gases leaking through the piston are brought back to the combustion chamber to prevent their discharge to the atmosphere.

● EGR, GPF/DPF: Reduce nitrogen oxide emissions by sensing the amount of recirculated exhaust gas at the engine intake while trapping residual particulate matter in the exhaust filter.

● Secondary air injection (SAI): It can quickly preheat the catalytic converter through "secondary air injection", so that vehicle emissions can be maintained within limits in various application scenarios (including during cold engine startup).

● (T) MAP: Monitors the air entering the engine, accurately adjusts the amount of fuel, thereby reducing fuel consumption.

Laurent Otte, Senior Product Line Manager at Melexis, said, "With a comprehensive PCB free product portfolio, OEMs are able to handle various pressure applications with ease. Customers benefit from platform solutions with high reusability, reducing development costs and reducing time to market."

Both MLX90823 and MLX90825 integrate sensors, signal processing circuitry, digital hardware, voltage regulators, SENT or analog output drivers, and all basic passive components. The MLX90825 supports pre calibrated Negative Temperature Coefficient (NTC) thermistor inputs (SENT outputs). Customers do not need to perform terminal calibration when connecting NTC through a pressure sensor chip. The chip integrates excellent overvoltage (+40V) and reverse voltage (- 40V) protection mechanisms. Thanks to its excellent protection range, this technology has made truck transportation more environmentally friendly. The operating temperature range of this series of pressure sensor chips is from - 40 ℃ to 160 ℃, and even can withstand temperatures as high as 170 ℃ for a short time, thereby supporting the trend of miniaturization of engine structures.

The MEMS sensing elements of the MLX90823 and MLX90825 consist of a micromechanical sensing film etched on a silicon substrate. The sensing membrane can respond to changes in pressure. The piezoresistive elements implanted in the sensing film can be connected to form a Wheatstone bridge to generate a signal. Subsequently, the onboard front-end electronics will amplify the signal and convert it into a digital signal. 16-bit digital signal processing (DSP) is responsible for temperature compensation. Finally, the results are provided via SENT output or analog output.

Both MLX90823 and MLX90825 have been developed as independent security units (SEooCs) that comply with ISO 26262 standards. MLX90825 (SENT output) can meet ASIL Level B requirements, and MLX90823 (analog output) can meet ASIL Level A requirements.

"Today, our customers can choose a range of PCB free sensor chips that can support differential mode, which gives them the ability to explore new opportunities in the market." said Karel Claesen, Product Manager for Pressure Sensor Chips at Melexis. "Customers benefit from this unique modular technology, which can handle demanding applications such as diesel and gasoline particulate filters."

About Meilaixin Company

Melexis combines unlimited enthusiasm for technology with inspirational engineering design ideas. It is committed to designing, developing, and providing innovative microelectronic solutions, helping designers smoothly transform ideas into ideal applications that perfectly fit future needs. Melexis has advanced mixed signal semiconductor sensors and actuator components, which can solve various challenges faced by new generation products and systems when integrating sensing, driving, and communication components. This not only helps to enhance the safety and efficiency of products and systems, but also helps to promote sustainable development and improve ease of use.

Melexis is a leading enterprise in the global automotive semiconductor sensor industry. Currently, each new car produced globally carries an average of 18 of our chips. Melexis makes full use of its core experience in automotive electronic components and actively serves other markets, including mobile travel, intelligent devices, smart buildings, robotics, energy management, and digital health.